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Danfore lighting | China’s Focus Lightings to Double Production Capacity with AIXTRON CRIUS II-L Systems | China led lighting
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China’s Focus Lightings to Double Production Capacity with AIXTRON CRIUS II-L Systems

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AIXTRON SE announced that China’s Focus Lightings Tech Inc. has ordered a number of CRIUS II-L systems for mass production of gallium nitride (GaN) light emitting diode (LED) epitaxial wafers. The systems will be configured to handle up to 69x2-inch wafers per run. The purchase was made in the fourth quarter of 2012. Shipment of the systems started in December 2012.

Huarong Pan, Chairman of Focus Lightings Tech, comments: “We eagerly await delivery of AIXTRON’s latest CRIUS Close Coupled Showerhead (CCS) generation for our future mass production of white-light LEDs. With the system’s low cost of ownership and high productivity as well as AIXTRON’s strong customer service in China, the CRIUS II-L systems will increase our competitiveness in the LED market.”

Tim Wang, General Manager at AIXTRON China, comments: “This new order from Focus Lightings Tech validates the production worthiness of the CRIUS II-L. I am convinced that Focus Lightings will soon benefit from the large production capacity and high throughput on a proven platform, along with the low cost of ownership, presently leading in the industry.”

The CRIUS II-L system allows easy process transfer from earlier CRIUS systems. Furthermore, the L equipment can be refitted for a new wafer size up to 8-inch diameter by a simple change of the carrier plate.

Focus Lightings Tech Inc., located in Suzhou High-tech Industry Park (SIP), Jiangsu province of China, is specializing in developing and manufacturing high quality LED semiconductor chips, LD laser chips, as well as in semiconductor Lightings and IC products. At its new plant the company houses chip production lines for red, yellow, blue, green, and white LED lights, as well as an R&D center that aims to realize 150 LM/W with proprietary technologies for mass production and to successfully step up chip production from two- to four-inch substrates.


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